18790258621 
SYJ-DS100 Precision Manual Wafer Scriber is suitable for cutting thin single crystal substrates, such as silicon, sapphire, Ge, LiNbO3 and LiTaO3 wafers, and the cutting pressure can be adjusted by a spring with the cutting distance of 100mm.
SYJ-DS100 Precision Manual Wafer Scriber is suitable for cutting thin single crystal substrates, such as silicon, sapphire, Ge, LiNbO3 and LiTaO3 wafers, and the cutting pressure can be adjusted by a spring with the cutting distance of 100mm.
SYJ-DS100 Precision Manual Wafer Scriber is suitable for cutting thin single crystal substrates, such as silicon, sapphire, Ge, LiNbO3 and LiTaO3 wafers, and the cutting pressure can be adjusted by a spring with the cutting distance of 100mm.
Technical Parameters
Product Name | SYJ-DS100 Precision Manual Wafer Scriber |
Product Model | SYJ-DS100 |
Cutting Procedure | |
1. Adjust the height of the diamond scriber. 2. Adjust the pressure of the spring. 3. Place the sample for scribing. | |
Replacing Diamond Scriber | |
1. Rotate the diamond scriber height adjustment dial and the spring pressure adjustment dial to the original point of 0. 2. Move theslide unit to the diamond scriber replacement position and remove the guide rod 3. Turn the handle over 90 degrees to the left 4. Loosen the screw by using the hex wrench and remove the diamond scriber 5. Install the new diamond scriber and tighten the screw 6. Return the handle to the scribing position and set the guide rod | |
Product Dimension | |
Dimension: 210 mm (L) x 210 mm (W) x 140 mm (H) | |
Warranty
One year limited with lifetime support (not including rusted parts due to inadequate storage conditions)
