The main parameters of Diamond Wire Saw Processing Machine

Power supply interface

National standard three-pole socket with insurance AC220 50Hz 10A

Total power

350W

370W

Diamond wire length

≤150m

Diamond wire diameter

φ0.25-0.45mm

Diamond wire tensioning method

Adjustable pneumatic tensioning

Tensioning pressure adjustment range

0.1-0.4Mpa

Spindle cutting rotation method

reciprocating rotation

Spindle drive motor

AC frequency conversion + reducer AC220V 300W

Spindle speed

5m/s adjustable

8m/s adjustable

Z-axis worktable effective stroke

≤160mm (the optional machine shall be subject to the actual product)

Y-axis worktable effective stroke

≤180mm

Z, Y-axis feed accuracy

0.01mm

Rotation angle table

Manual: Horizontal 0-360°

Electric: Horizontal 0-360°

Angle table

Manual: ±15°

Electric: ±10°

Y-axis, Z-axis, R-axis drive motor

Precision stepper motor

Maximum spacing between the inner sides of the two guide wheels

≤180mm

Maximum workpiece diameter and length for cutting

Φ150mmX150mm

Worktable center load-bearing

≤10Kg

≤5Kg

Control method

PLC programmer + 4.3-inch touch screen

PLC programmer + 7-inch touch screen

Parameter display form

digital

Remote control handle (tool setting)

----

Wired remote control handle

Safety control device

Bobbin overtravel, thread breakage automatic stop, emergency stop switch

Overall dimensions of Diamond Wire Saw Cutting Tools

(length x width x height mm)

640x700x1450mm

617×620×1500mm

720×1030×1800mm

Installation conditions of Diamond Wire Saw Cutting Tools 

1.Temperature and humidity: 10-85%RH (at 25℃ without condensation) Temperature: 0-45℃.

2.There are no strong earthquake sources and corrosive gases around the Diamond Wire Saw Processing Machine.

3.Power supply: single phase: AC220V 50Hz, national standard three-pole socket 10A, must be well grounded.

4.Air source (compressed air): ≥0.6Mp 

5.Coolant: required (recommended to use --- cutting oil) 

6.Workbench: no requirement 

7.Ventilation device: no special requirements

Functional use of Diamond Wire Saw Processing Machine

1. Ceramic materials: alumina ceramics, zinc oxide ceramics, zirconium oxide ceramics, target ceramics, honeycomb ceramics, semiconductor ceramics, conductive ceramics, non-conductive ceramics, etc.;

2. Crystal materials: graphite, silicon crystals (solar polysilicon, single crystal silicon), sapphire, alumina crystals, infrared glass crystals, alumina crystals, silicon carbide crystals, cesium iodide crystals, etc.;

3. Glass materials: chalcogenide glass, optical glass, quartz glass, infrared glass, glass tubes, etc.;

4. Metal materials: iron, aluminum, copper, titanium alloy, magnesium alloy and other metals and alloys, Nonferrous metals (zinc sulfide, ferrite), etc.

5. Composite materials: PVC board, carbon fiber composite materials, glass fiber composite materials, etc.

6. Rock materials: precision cutting of natural rocks, jade, meteorites, Pei Cui, agate, etc., precision slicing of various high-value materials, geological optical slices, geological thin slices (sedimentary rocks, igneous rocks, metamorphic rocks, ores), etc.;

7. Thermoelectric materials: bismuth telluride, lead telluride, silicon-germanium alloy, etc.

8. Infrared optical materials: crystals of zinc selenide, zinc sulfide, silicon, germanium, etc.;

9. Biomedical materials: Biological plasticized specimen sections (human and animal organs, jaw soft and hard tissue sections, implant observation, dental crowns and bridges, teeth and other histological specimens); orthopedic soft and hard tissue sections (femur, hip joint, vertebral body and other living tissues and hard tissues, bone histological samples with implants, etc.); cardiovascular stent sections, stone sections and other medical tissue sections;

......

Note: Materials with a hardness less than diamond wire can be precisely cut