Continuous Loop Diamond Saw Functions and Applications | 1. Ceramic materials: alumina ceramics, zinc oxide ceramics, zirconium oxide ceramics, target ceramics, honeycomb ceramics, semiconductor ceramics, conductive ceramics, non-conductive ceramics, etc.; 2. Crystal materials: graphite, silicon crystals (solar polysilicon, single crystal silicon), sapphire, alumina crystals, infrared glass crystals, alumina crystals, silicon carbide crystals, cesium iodide crystals, etc.; 3. Glass materials: chalcogenide glass, optical glass, quartz glass, infrared glass, glass tubes, etc.; 4. Metal materials: iron, aluminum, copper, titanium alloy, magnesium alloy and other metals and alloys, non-ferrous metals (zinc sulfide, ferrite), etc.; 5. Composite materials: PVC board, carbon fiber composite materials, glass fiber composite materials, etc.; 6. Rock materials: precision cutting of natural rocks, jade, meteorites, Pei Cui, agate, etc.; precision slicing of various high-value materials; slicing of geological light slices, geological thin slices (sedimentary rocks, igneous rocks, metamorphic rocks, ores), etc.; 7. Thermoelectric materials: bismuth telluride, lead telluride, silicon-germanium alloy, etc.; 8. Infrared optical materials: crystals such as zinc selenide, zinc sulfide, silicon, germanium, etc.; 9. Biomedical materials: bioplastic specimen slicing (human and animal organs, combined slices of soft and hard tissues of the jaw, implant observation, dental crowns and bridges, teeth, etc. histological specimens); orthopedic soft and hard tissue slicing (fresh and hard tissues such as femurs, hip joints, vertebral bodies, bone histological samples with implants, etc.); cardiovascular and cerebrovascular stent slicing, stone slicing and other medical tissue slicing; ...... Note: Materials with hardness less than diamond wire can be precisely cut.
|